Level-set based inverse lithography technology (ILT) treats photomask design for microlithography as an inverse mathematical problem, interpreted with a time-dependent model, and then solved as a partial differential equation with finite difference schemes. This paper focuses on developing level-set based ILT for partially coherent systems, and upon that an expectation-orient optimization framework weighting the cost function by random process condition variables. These include defocus and aberration to enhance robustness of layout patterns against process variations. Results demonstrating the benefits of defocus-aberration-aware level-set based ILT are presented.